Head of Device Fabrication, Advanced Packaging, and Assembly

• Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test
• Build, lead, and develop a high-performing team of engineers, scientists, technical specialists, and managers across Singapore and Japan
• Lead development and optimisation of foundry processes from concept through production
• Drive development and industrialisation of advanced packaging, assembly, bonding, and interconnect solutions
• Build and manage strategic relationships with foundries, suppliers, and technology partners
• Own R&D programmes for foundry, assembly, and packaging technology
• Establish qualification and control processes for scalable, reliable manufacturing
• Partner with engineering, design, product, and architecture teams to translate requirements into manufacturable specifications
• Maintain integrated development plans, budgets, suppliers, risks, and performance measures
• Ensure process and package technologies meet quality, reliability, safety, export-control, regulatory, and contractual requirements

• Degree (or equivalent experience) in Semiconductor Engineering, Materials Science, Physics, Microelectronics, Mechanical Engineering, Chemical Engineering, or a related technical discipline
• Demonstrated success leading and developing multidisciplinary technical teams, including senior engineers, specialists, and managers
• Significant experience leading semiconductor process development, advanced packaging, assembly, or device industrialisation within a foundry, IDM, OSAT, deep-tech, or similar environment
• Proven track record taking process and technology development from concept through qualification, yield improvement, supplier transfer, and production readiness
• Strong technical expertise across microfabrication, wafer processing, lithography, deposition, etch, wafer bonding, die attach, interconnects, packaging, metrology, reliability, or failure analysis
• Experience selecting, managing, and developing relationships with foundries, OSATs, suppliers, and external manufacturing partners
• Experience working across multiple functions with design, ASIC, systems engineering, product, and architecture teams to deliver manufacturable solutions
• Proven ability to lead in complex, multi-site or international environments

• Opportunity to shape the future of quantum computing products and organisation
• Career growth opportunities
• Opportunities to broaden expertise
• Meaningful, high-impact engineering challenges
• Work alongside world-class scientists and engineers
• Inclusive environment where everyone can thrive
• Diversity and inclusion commitment
• Welcoming team members from all backgrounds