Manufacturing Quality Engineer

• Lead new product introduction activities from product transfer through process qualification, validation, manufacturing readiness, and production release
• Develop, qualify, and optimize semiconductor package assembly processes, including SMT, die attach, wire bond, flip-chip, dispensing, underfill, and backend assembly operations
• Drive BGA characterization, including stencil optimization, reflow profiling, DOE, BGA rework qualification, and assembly process validation
• Establish and maintain PFMEA, Control Plans, Process Flow Diagrams, work instructions, quality plans, and manufacturing process documentation
• Define process controls, SPC monitoring requirements, process capability targets, and CTQ characteristics
• Lead root cause investigations and corrective actions using 8D, DMAIC, DOE, 5-Why, and statistical analysis tools
• Support failure analysis using AXI, CT scan, cross-sectioning, EDX, dye-and-pry, and other analytical techniques
• Drive yield improvement, defect reduction, process optimization, and continuous improvement initiatives
• Manage non-conforming materials, containment activities, MRB reviews, corrective actions, and preventive action programs
• Support supplier quality activities, manufacturing partner audits, process qualifications, and customer quality requirements
• Serve as primary technical interface for manufacturing readiness reviews, process-related issues, and customer quality escalations
• Conduct DFM/DFX reviews and identify manufacturing risks to improve quality, yield, manufacturability, and operational efficiency
• Deliver successful new product introductions and manufacturing transfers
• Establish robust, scalable, and capable manufacturing processes
• Improve manufacturing yields and reduce defect rates
• Complete manufacturing readiness, qualification, and production milestones on time

• Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or a related discipline
• Hands-on experience supporting semiconductor package assembly processes, including flip-chip assembly, dam-and-fill, die attach, and wire bond technologies
• Strong experience with NPI, product transfer, process qualification, validation, and manufacturing readiness activities
• Experience with SMT assembly, BGA processes, reflow profiling, dispensing, underfill processes, and manufacturing process controls
• Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, process capability studies, and yield improvement methodologies
• Strong analytical, problem-solving, communication, and technical documentation skills
• Ability to collaborate with engineering, manufacturing, suppliers, customers, and contract manufacturing partners
• Experience managing manufacturing quality and process-related issues in a high-technology manufacturing environment
• Six Sigma Green Belt, Black Belt, CQE, or equivalent quality certification
• Experience supporting advanced packaging technologies, including flip-chip assembly and large BGA characterization
• Experience utilizing failure analysis methods such as AXI, CT scan, cross-sectioning, EDX, and related diagnostic tools
• Experience working with EMS, ODM, or contract manufacturing partners
• Experience supporting optical, photonics, telecommunications, semiconductor, or high-reliability electronics manufacturing environments
• Knowledge of supplier quality systems, audits, qualification processes, and manufacturing excellence frameworks
• Preferred location: Vietnam
• Preferred languages: Vietnamese and English
• Chinese language capability is an additional advantage

• Flexible work environment
• Employee growth opportunities
• Well-being support
• Belonging-focused culture
• Community and societal impact initiatives